Fabrication of capacitive absolute pressure sensor using Si-Au eutectic bonding in SOI wafer
نویسندگان
چکیده
منابع مشابه
Investigation of Au/Si Eutectic Wafer Bonding for MEMS Accelerometers
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ژورنال
عنوان ژورنال: Journal of Physics: Conference Series
سال: 2006
ISSN: 1742-6588,1742-6596
DOI: 10.1088/1742-6596/34/1/064